JH-SG-16

Hubei JohnHo New Materials Technology Co., Ltd.

Headquarter:RT Office Building, Longhuashan, Xiantao City, Hubei, China

Production Base:Qilu Chemical Park, Zibo City, Shandong, China.

TDS for JH-SG-16 Thermal Silicone Gel

‌Product Description

JH-SG-16‌ is a soft interface thermal conductive dielectric material synthesized via a special process. Featuring high thermal conductivity, low interfacial thermal resistance and excellent thixotropy, it is an ideal material for applications with large gap tolerance and high heat dissipation demands. It is commonly used to fill irregular gaps between heat-generating electronic components and radiator housings, enabling tight contact between the two sides, reducing thermal resistance, and quickly and effectively lowering the temperature of electronic components. This extends the service life of electronic components and improves their reliability. The product can be dispensed and coated manually or by automatic dispensing equipment.

Features

1.‌Excellent high temperature resistance‌, with an operating temperature range of ‌-40℃ to 150℃‌.

2.‌Good plasticity‌, easy to operate, especially suitable for filling irregular gaps.

3.The thermal conductive gel is in paste form, with good shape retention, no flow and low volatility.

4.It has excellent compressibility, and can be compressed to a minimum thickness of ‌0.1mm‌, which reduces interfacial thermal resistance and improves heat transfer efficiency.

Technical Specifications

Note: The above data are measured under specific laboratory conditions and do not represent product specification values.

‌Application Scenarios‌

It is used for gap filling between heat-dissipating modules and radiators in products such as battery modules, on-board chargers, automotive module power supplies, inverters, the control mainboards of these products, the inner and outer gaskets of motors, as well as communication equipment, security equipment, automotive machinery, automotive electronics, network communication equipment, communication signal base stations, computer hosts, laptops, CPUs, GPUs and other heat-generating components.

Usage Recommendations

Before using this product, ensure the filling area is dry and clean. A contaminated surface will reduce the filling tightness, increase the interfacial contact thermal resistance, and weaken the application effect of this product.